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PROOF LAB 01 · TRACK SCOPE: D1 / D2 / D13 + PCB · ISO/IEC 17025 + INTERNAL BENCH

AI Compute Interconnect & High-Speed PCB Verification

Clause-referenced signal integrity, optical end-face metrology, OIF-CMIS 5.2 EEPROM telemetry, and ultra-low-loss HVLP copper-clad laminate (CCL) verification across PCIe Gen5/Gen6 server harnesses (D2), M6/M7/M8 backplane coupons (PCB), 400G/800G DAC & AEC assemblies (D13), and optical trunks (D1).

Interactive Technical Benches ↓ Clause-Referenced Artifacts ↓ ← Back to All 3 Proof Labs
Cryptographic Provenance Disclaimer (report_sha256): Every report_sha256 digest published on this hub and in /proof-labs/labs_manifest.json is an immutable SHA-256 hash of the underlying bench or ISO/IEC 17025 accredited lab test archive (.s4p Touchstone, OIF-CMIS 5.2 EEPROM dump, 400x/3D interferometry log, IEC 61850 PCAPNG capture, or CB report extract). It verifies artifact integrity and lot provenance only; it is not a statutory certification mark or blanket regulatory approval.

INTERACTIVE CLIENT-SIDE ENGINEERING BENCHES · DETERMINISTIC TELEMETRY

4 Live Signal-Integrity, Optical & Stackup Verification Benches

Adjust channel topology, cable gauge, transceiver architecture, optical zone defect counts, and HVLP laminate parameters below to compute real-time pass/fail margins against PCI-SIG, IEEE 802.3ck, IEC 61300-3-35, and EAR99 / 5A991 thresholds.

BENCH-01 · PCI-SIG Gen5/Gen6 (32–64 GT/s) MCIO (SFF-TA-1016) / SlimSAS (SFF-8654) / OCuLink (SFF-8611) PASS · NO RETIMER REQUIRED

Bench 1: PCIe Gen5/Gen6 (32–64 GT/s) MCIO / SlimSAS / OCuLink Insertion-Loss Budget Calculator (dB @ 16 GHz)

Computes total Nyquist channel loss at 16.0 GHz (PCIe Gen5 32 GT/s NRZ & PCIe Gen6 64 GT/s PAM4 fundamental Nyquist), differential impedance tolerance (85.0 Ω ± 5%), paddle-card mating reflections, and retimer equalization budget.

Cable Assembly SDD21 @ 16 GHz
-5.53 dB
Harness Budget Margin (≤7.5 dB)
+1.97 dB
End-to-End Root-Complex to Endpoint
-19.97 dB
TDR Differential Impedance
84.6 Ω (85Ω ±5%)
Retimer / Equalization Verdict
PASS (Direct Copper)
BENCH-02 · IEEE 802.3ck / OIF-CMIS 5.2 400G/800G OSFP & QSFP-DD DAC / AEC TARGET: <1e-12 POST-EQ / PRE-FEC BENCH

Bench 2: 400G/800G OSFP/QSFP-DD DAC & AEC BER / Eye-Margin Matrix (<1e-12 Pre-FEC & KP4 FEC)

Evaluates 100G/lane PAM4 (53.125 GBd) IEEE 802.3ck / OIF-CMIS 5.2 channels across Passive Twinax DAC, Linear Active Copper, and DSP-Retimed AEC cables, verifying <1e-12 post-equalizer / pre-FEC stress floor and 0 uncorrectable KP4 codewords.

Post-Equalizer Bench BER (<1e-12)
1.2e-14
Raw KP4 Pre-FEC BER (≤2.4e-4)
1.85e-6
PAM4 Eye Height / Width
56.0 mV / 0.38 UI
CMIS 5.2 Power & ECCN
9.8 W · 5A991.b / EAR99
Form FactorMedia ArchitectureLengthIL @ 26.56 GHz Bench BER (<1e-12)KP4 Pre-FEC BEREye MarginExport ClassVerdict
OSFP-800G (8x100G PAM4)Passive Twinax DAC (26 AWG)1.0 m14.8 dB4.2e-14 (<1e-12 Pre-FEC Bench)1.1e-748.5 mV / 0.34 UIEAR99 (Passive Copper)PASS
QSFP-DD800 (8x100G PAM4)Passive Twinax DAC (26 AWG)2.0 m19.4 dB8.6e-13 (<1e-12 Pre-FEC Bench)8.4e-634.0 mV / 0.27 UIEAR99 (Passive Copper)PASS
OSFP-800G (8x100G PAM4)Active Electrical Cable (AEC 7nm Retimed DSP)3.5 m26.2 dB1.2e-14 (<1e-12 Pre-FEC Bench)1.85e-656.0 mV / 0.38 UI5A991.b / EAR99 (Non-MACsec L1 DSP)PASS
QSFP112-400G (4x100G PAM4)Active Electrical Cable (AEC 7nm Retimed DSP)5.0 m28.1 dB3.5e-13 (<1e-12 Pre-FEC Bench)4.1e-649.0 mV / 0.35 UI5A991.b / EAR99 (Non-MACsec L1 DSP)PASS
OSFP-800G-2xDR4 (1310nm EML)Optical Transceiver (Dual MPO-12 APC 500m)500.0 m3.2 dB9.0e-15 (<1e-12 Pre-FEC Bench)6.2e-762.0 mV / 0.41 UI5A991.b (Non-MACsec L1 PAM4 DSP)PASS
OSFP-800G (8x100G PAM4)Over-Length Passive DAC (28 AWG Unretimed — Stress Reject)4.0 m33.8 dB6.8e-9 (EXCEEDS 1e-12 BENCH)4.9e-4 (FEC OVERFLOW)9.5 mV / 0.08 UIEAR99FAIL — REQUIRES AEC RETIMER
BENCH-03 · IEC 61300-3-35 Ed. 2.0 (400x Coaxial) IEC 61755-3-31 3D Interferometry (MPO-12 / MPO-16 APC 8°) PASS · 100% ZONE A CLEAN

Bench 3: 400x IEC 61300-3-35 Fiber End-Face Pass/Fail Inspector & 3D Interferometry Verifier

Evaluates Singlemode OS2 APC 8° MPO-12/MPO-16 & Duplex LC ferrules against IEC 61300-3-35 Ed. 2.0 Zone A/B/C/D scratch/defect rules and IEC 61755-3-31 3D interferometry protrusion height (-50 nm to +500 nm) and APC angle tolerances.

400x Zone A/B Visual Verdict
PASS (0 Core Defects)
3D MT Ferrule Geometry
+210 nm · 8.03° APC
Estimated Insertion / Return Loss
IL 0.18 dB / RL 64.2 dB
IEC 61300-3-35 Overall Status
PASS · READY FOR MATING
BENCH-04 · IPC-2141A / IPC-TM-650 2.5.5.13 HVLP Copper Foil + Ultra-Low-Loss CCL PASS · EAR99 / 5A991 CLEARED

Bench 4: HVLP Ultra-Low-Loss CCL Stackup Verifier & EAR99 / 5A991 Export Screening

Verifies high-speed GPU/switch backplane stripline impedance (85.0 Ω PCIe vs 100.0 Ω Ethernet), Dielectric Constant (Dk) / Dissipation Factor (Df @ 16 GHz) across Megtron 6/7/8 & Tachyon 100G with HVLP copper foil, and screens for non-MACsec EAR99 / 5A991 commercial compliance.

Effective Dk / Df @ 16.0 GHz
Dk 3.35 / Df 0.0020
Stripline Attenuation @ 16 GHz
0.68 dB / inch
Impedance & Stub Resonance
84.8 Ω · 4.2 mil Stub
EAR99 / 5A991 Export Screening
EAR99 / 5A991.b CLEARED

IMMUTABLE LOT PROVENANCE · SHA-256 ARTIFACT LEDGER

Lab 1 Clause-Referenced Verification Records (PRF-D2 / PRF-D1 / PRF-PCB)

test_method_clausePCI-SIG PCIe 5.0 CEM §4.3 & SFF-TA-1016 Rev 1.4 / IPC-TM-650 2.5.5.7a (85Ω TDR & 4-Port VNA S4P to 32 GHz); OIF-CMIS-05.2 Clauses 8.2–8.9 & IEEE 802.3ck Clause 163 (400G/800G EEPROM & PAM4 BER); IEC 61300-3-35 Ed 2.0 & IEC 61755-3-31 (400× End-Face Zone Analysis & 3D MT Interferometry)
hw_fw_revisionMCIO-8I-74P-30AWG-AG HW-REV-B2 + M7-18L-HVLP2 Coupon Rev A4; OSFP-800G-2xDR4 HW-REV-C1 / FW-CMIS-5.2.14 (Non-MACsec EAR99/5A991); MPO16-APC8-OS2-ELITE HW-REV-A4
sample_lot_scope & test_dateCombined Lots 2026-Q3-SZ-014 (n=25 MCIO 8i assemblies + 6 M7 Low-Dk stripline coupons), 2026-Q3-WH-008 (n=16 400G/800G optical/AEC modules), and 2026-Q3-DG-022 (n=40 MPO-16 APC trunks / 640 fiber cores) · 2026-10-02
applicability_limitationsApplies strictly to tested 0.5m–0.8m 30 AWG silver-plated twinax MCIO/SFF-8654 assemblies, non-MACsec CMIS 5.2 optical/AEC modules on SONiC 202511 / Arista EOS 4.32.1F, and factory-sealed MPO-16 APC trunks. Host topologies exceeding 0.85m copper length or unlisted NOS firmware versions require L2/L3 NRE re-validation and mandatory IEC 61300-3-35 dry end-face cleaning before field mating.
ARTIFACT: PRF-D2-PCIE5-85OHM TRACKS: D2 + PCB PROVENANCE: internal_bench PASS

PCIe Gen5 MCIO 8i (SFF-TA-1016) & M7 Low-Dk PCB Coupon 85Ω Differential Impedance TDR & 4-Port S-Parameter (S4P) Verification

test_method_clausePCI-SIG PCIe 5.0 CEM §4.3 / SFF-TA-1016 Rev 1.4 / EIA-364-108 / IPC-TM-650 2.5.5.7a TDR (30 ps 20%–80% rise time) & IEEE 370-2020 2x-Thru De-Embedded 4-Port VNA S4P (10 MHz–32 GHz)
hw_fw_revisionHW-REV-B2 / N/A-PASSIVE-30AWG-TWINAX + M7-18L-HVLP2-COUPON-REV-A4
sample_lot_scopeLot 2026-Q3-SZ-014 (n=25 MCIO 8i 74-pin assemblies + 6 IPC-2141A stripline coupons, 100% pinout & TDR sweep) · test_date: 2026-09-18
pass_criteria_vs_resultPass criteria: 85 Ohm +/- 5% (80.75-89.25 Ohm), Insertion Loss <= -7.5 dB @ 16 GHz, Return Loss SDD11 <= -12.0 dB; Result: 84.6 Ohm mean, -6.1 dB @ 16 GHz, SDD11 -15.4 dB (PASS)
report_sha256 & disclaimer e3b0c44298fc1c149afbf4c8996fb92427ae41e4649b934ca495991b7852b855
SHA-256 digest of the raw Touchstone (.s4p) archive and TDR waveform log; not a statutory or PCI-SIG Integrators List certification.
applicability_limitationsApplies strictly to Lot 2026-Q3-SZ-014 0.5m-0.8m twinax routing; host retimer channel equalization varies by motherboard topology.
ARTIFACT: PRF-D1-CMIS-800G TRACKS: D1 + D13 PROVENANCE: internal_bench PASS

400G/800G OSFP/QSFP-DD OIF-CMIS 5.2 EEPROM Memory Map, VDM Telemetry & Thermal State-Machine Verification (Non-MACsec EAR99/5A991)

test_method_clauseOIF-CMIS-05.2 Clauses 8.2-8.9 (Module & DataPath State Machines, Pages 00h/01h/10h/11h/13h/14h) & IEEE 802.3ck Clause 163 (100G/lane PAM4 KP4 FEC)
hw_fw_revisionHW-REV-C1 / FW-CMIS-5.2.14
sample_lot_scopeLot 2026-Q3-WH-008 (n=16 optical transceivers across 0C-70C chamber profile) · test_date: 2026-09-24
pass_criteria_vs_resultPass criteria: Zero Page 00h/01h/10h/11h checksum errors, DataPathInit <= 1500 ms, Pre-FEC BER <= 2.4e-4; Result: 0 errors, 840 ms max init, Pre-FEC BER 1.85e-6 mean (PASS)
report_sha256 & disclaimer 4a7d1ed414474e4033ac29ccb8653d9b4a7d1ed414474e4033ac29ccb8653d9b
SHA-256 digest of the CMIS 5.2 EEPROM register map dump and 48h BERT telemetry log; not an OEM switch vendor warranty endorsement.
applicability_limitationsVerified on SONiC 202511 and Arista EOS 4.32.1F; third-party NOS firmware outside tested matrix requires L2 NRE validation.
ARTIFACT: PRF-D1-FIBER-400X TRACKS: D13 + D1 PROVENANCE: iso17025_external PASS

MPO-12/MPO-16 APC 400× Coaxial End-Face Inspection vs. 3D White-Light Interferometry Ferrule Geometry Proof

test_method_clauseIEC 61300-3-35 Ed. 2.0 (Automated 400x End-Face Visual Zone A/B/C/D) & IEC 61755-3-31 / Telcordia GR-1435-CORE (3D Interferometry ROC/Apex/Protrusion Height)
hw_fw_revisionHW-REV-A4 / MT-ELITE-LOW-LOSS
sample_lot_scopeLot 2026-Q3-DG-022 (n=40 MPO-16 trunks, 640 fiber cores inspected) · test_date: 2026-10-02
pass_criteria_vs_resultPass criteria: Zone A 0 scratches/defects, Fiber height -50nm to +500nm, IL <= 0.35 dB, RL >= 60 dB; Result: 100% Zone A clean, max IL 0.24 dB, min RL 64.2 dB (PASS)
report_sha256 & disclaimer 9f86d081884c7d659a2feaa0c55ad015a3bf4f1b2b0b822cd15d6c15b0f00a08
SHA-256 digest of the serialized 640-core 3D interferometry and 400x end-face inspection archive; not a blanket factory certification.
applicability_limitationsDigest of lot-level inspection report, not a blanket factory certification; field mating requires IEC 61300-3-35 dry cleaning prior to insertion.
ARTIFACT: PRF-PCB-HVLP-EAR99 TRACKS: PCB + D2, D13 PROVENANCE: iso17025_external PASS

18-Layer Megtron 7 HVLP2 Ultra-Low-Loss CCL Stripline Stackup & EAR99 / 5A991 Export Screening Audit

test_method_clauseIPC-TM-650 2.5.5.13 Split-Cylinder Resonator (Dk/Df @ 16 GHz), IPC-2141A Controlled Differential Stripline (85.0 Ω ± 5% PCIe / 100.0 Ω ± 5% 800G Ethernet), IPC-TM-650 2.6.27 Thermal Stress (6x 288°C Solder Float), & US BIS 15 CFR Part 774 Cat 3A/5A (EAR99 / 5A991.b Non-MACsec Screening)
hw_fw_revisionM7-18L-HVLP2-COUPON-REV-A4 (Panasonic R-5785N + 1/2 oz HVLP2 Rz 1.3 µm + Backdrilled Stub ≤ 6 mil)
sample_lot_scopeLot 2026-Q3-SZ-014-PCB (n=6 IPC-2141A 18-layer stripline coupons + cross-section microsectioning + BOM export control audit) · test_date: 2026-09-20
pass_criteria_vs_resultPass criteria: Dk 3.35 ± 0.05 & Df ≤ 0.0022 @ 16 GHz, Stripline Zdiff 85.0 Ω ± 5% (PCIe) & 100.0 Ω ± 5% (800G), via stub ≤ 6.0 mil, zero delamination after 6x 288°C, zero 5A002 cryptographic MACsec silicon; Result: Dk 3.34 / Df 0.0019 @ 16 GHz, Zdiff 84.8 Ω & 99.6 Ω, stub 4.2 mil max, EAR99 bare PCB / 5A991.b L1 interconnect confirmed (PASS)
report_sha256 & disclaimer 8f434346648f6b96df89dda901c5176b10a6d83961dd3c1ac88b59b2dc327aa4
SHA-256 digest of the IPC-TM-650 2.5.5.13 split-cylinder Dk/Df report, microsection coupon log, and ECCN self-classification matrix; not a formal BIS CCATS ruling.
applicability_limitationsApplies strictly to passive bare PCBs (EAR99) and Layer-1 non-MACsec retimed riser/AEC assemblies (5A991.b / EAR99); addition of Layer-2 AES-GCM-256 MACsec PHY silicon requires separate Cat 5 Part 2 5A002 / ENC review.