Global TFLN (LNOI) Wafer & Modulator Suppliers: 2026 Technical Sourcing Guide
For China-capable TFLN/LNOI sourcing in 2026, the practical shortlist is NanoLN for raw wafers with low MOQ and fast sample lead time, AFR for high-volume 800G/1.6T modulator chips, and Liobate for custom IDM and MPW foundry work. The supplier table below is a technical screening directory; specs are indicative, not guaranteed.
Supplier directory
| Supplier | Country | Wafer (size/cut/film) | Modulator/PIC | MOQ | Lead time | Export note | Sample |
|---|---|---|---|---|---|---|---|
| NanoLN (Jinan Jingzheng) | China | 4/6/8in, X&Z-cut, MgO, 300-900nm | material specialist | 1 wafer | 2-8 wk | MOFCOM dual-use may apply | Yes |
| Liobate | China | 4/6/8in, X-cut, 300-700nm | IDM 400G/1.6T + MPW foundry | 5-10 wafers | 6-12 wk | dual-use licensing | Yes |
| AFR (Advanced Fiber Resources) | China | in-house 6in (acquired Lumentum LN line) | 800G/1.6T DR8 chips | high-volume | 8-16 wk | moderate | eval kits |
| Ori-Chip | China | 4in LNOI | integrated 1.6T PICs | project | 4-10 wk | low | Yes |
| SITRI | China | 6/8in LNOI-on-Si | 200mm SiPh foundry | MPW | 3-5 mo | US-equipment-restriction risk | Foundry |
| HyperLight | USA | via UMC 6/8in chiplet | 110/145GHz modulators | 1-5 chips | 3-6 mo | ITAR/EAR above 40GHz | eval |
| CCRAFT/CSEM | Switzerland | 6in, 600nm, 4.7um BOX | pure-play foundry | MPW | 3-4 mo | EU export rules | Foundry |
| Partow Tech | USA | 3/4/6in ion-slicing | custom substrates | 3-5 wafers | 6-10 wk | US tech-transfer | Yes |
| NTT Innovative | Japan | 2-6in R&D | 3.2T engines | R&D | 4-6 mo | Japan export rules | limited |
Verify on the live registry and directly with the supplier before procurement. Specs, lead times, samples, MOQs, and export notes are indicative, not guaranteed.
Six key spec questions to ask
- TTV / GCIB trimming: what total thickness variation is guaranteed, and is gas cluster ion beam trimming included or available?
- Propagation loss at 1550nm: what test structure, waveguide geometry, and measurement method support the quoted loss?
- BOX thickness >4um: can the supplier provide 4um or thicker buried oxide for leakage-sensitive designs?
- Coupling loss to SMF-28: what grating, edge coupler, spot-size converter, or fibre-array data supports the claim?
- DC bias drift + integrated heaters: what stability data exists over temperature, drive voltage, and operating hours?
- MOFCOM dual-use licence: does the wafer, modulator, technical data, destination, or end use trigger licensing review?
How to use this directory
Start with the device layer you need. If the project needs raw TFLN wafers for in-house process development, qualify crystal cut, film thickness, BOX, TTV, bow, warp, particle count, and sample history. If the project needs a modulator or PIC, qualify optical bandwidth, RF bandwidth, Vpi, insertion loss, bias drift, packaging, and whether evaluation kits are available.
Then connect the supplier shortlist to the sourcing path. For earlier-stage programs, see deep-tech sourcing. For procurement execution, supplier qualification, and commercial negotiation, see the process. Export-control review should run before technical data packages, masks, design files, or end-use statements are exchanged.
Frequently asked questions
Who are the best China-capable TFLN sources for 2026?
For China-capable sourcing, NanoLN is the practical starting point for raw wafers with low MOQ and fast sample lead time; AFR is the stronger fit for high-volume 800G and 1.6T modulator chips; Liobate is relevant for custom IDM and MPW foundry paths.
Are the TFLN wafer specifications in this directory guaranteed?
No. All specifications, MOQs, lead times, export notes, and sample availability are indicative and must be verified directly with the supplier before procurement.
What TFLN wafer questions should buyers ask first?
Ask about TTV and GCIB trimming, propagation loss at 1550 nm, BOX thickness above 4 um, coupling loss to SMF-28, DC bias drift and integrated heaters, and whether a MOFCOM dual-use licence applies.
Do TFLN modulators trigger export-control review?
They can. High-speed modulators, dual-use photonics, and cross-border technical transfer may trigger MOFCOM, EAR, ITAR, EU, Swiss, or Japan export-control review depending on frequency, end use, destination, and technical data shared.
全球TFLN（LNOI）晶圆与调制器供应商：2026技术采购指南
2026年中国能力覆盖的TFLN/LNOI采购起点：NanoLN适合低MOQ、快速样品的原始晶圆；AFR适合高批量800G/1.6T调制器芯片；Liobate适合定制IDM与MPW代工路径。Asaptic is an independent sourcing partner; listings are compiled from public registries — verify the current record before procurement.
所有规格、交期、样品、MOQ与出口说明均为指示性信息，采购前必须与供应商及适用出口管制流程核实。
全球TFLN（LNOI）晶圓與調制器供應商：2026技術採購指南
2026年中國能力覆蓋的TFLN/LNOI採購起點：NanoLN適合低MOQ、快速樣品的原始晶圓；AFR適合高批量800G/1.6T調制器芯片；Liobate適合定制IDM與MPW代工路徑。Asaptic is an independent sourcing partner; listings are compiled from public registries — verify the current record before procurement.
所有規格、交期、樣品、MOQ與出口說明均為指示性信息，採購前必須與供應商及適用出口管制流程核實。