--- source: https://asaptic.com/pt/proof-labs/ai-compute-interconnect/ title: Proof Lab 1: Interconexão de Computação IA e PCB de Alta Velocidade (D1/D2/D13+PCB) | Asaptic description: Bancadas de engenharia interativas e verificação ISO/IEC 17025 para Interconexão de Computação IA: calculadora de perda de inserção PCIe Gen5/Gen6 (32–64 GT/s) MCIO/SlimSAS/OCuLink (dB @ 16 GHz), matriz BER/margem de olho 400G/800G OSFP/QSFP-DD DAC & AEC (<1e-12 pré-FEC), inspetor de fibra 400x IEC 61300-3-35 e verificador de stackup CCL HVLP (triagem EAR99 / 5A991). --- # Proof Lab 1: Interconexão de Computação IA e PCB de Alta Velocidade (D1/D2/D13+PCB) | Asaptic PROOF LAB 01 · ÂMBITO: D1 / D2 / D13 + PCB · ISO/IEC 17025 + BANCADA INTERNA # Interconexão de Computação IA e Verificação de PCB de Alta Velocidade Integridade de sinal referenciada por cláusula, metrologia de face final óptica, telemetria EEPROM OIF-CMIS 5.2 e verificação de laminados revestidos de cobre (CCL) HVLP de perda ultrabaixa em chicotes PCIe Gen5/Gen6 (D2), cupões de backplane M6/M7/M8 (PCB), cabos 400G/800G DAC & AEC (D13) e troncos MPO (D1). [Bancadas Técnicas Interativas ↓](#interactive-benches) [Registos de Verificação ↓](#clause-artifacts) [← Voltar aos 3 Proof Labs](/pt/proof-labs/) **Aviso de Proveniência Criptográfica (report_sha256):** Cada resumo report_sha256 publicado neste hub e em /proof-labs/labs_manifest.json é um hash SHA-256 imutável do arquivo bruto de ensaio em bancada ou laboratório acreditado ISO/IEC 17025 (.s4p Touchstone, dump EEPROM OIF-CMIS 5.2, log de interferometria 400x/3D, captura PCAPNG IEC 61850 ou extrato CB). Verifica apenas a integridade do artefacto e a proveniência do lote; não constitui marca de certificação estatutária. BANCADAS DE ENGENHARIA INTERATIVAS · TELEMETRIA DETERMINÍSTICA ## 4 Bancadas de Integridade de Sinal, Óptica e Empilhamento PCB em Tempo Real Ajuste a topologia do canal, calibre do cabo, arquitetura do transceptor, defeitos por zona óptica e parâmetros do laminado HVLP abaixo para calcular margens Pass/Fail em tempo real segundo PCI-SIG, IEEE 802.3ck, IEC 61300-3-35 e EAR99 / 5A991. BENCH-01 · PCI-SIG Gen5/Gen6 (32–64 GT/s) MCIO (SFF-TA-1016) / SlimSAS (SFF-8654) / OCuLink (SFF-8611) PASS · NO RETIMER REQUIRED ### Bancada 1: Calculadora de Orçamento de Perda de Inserção PCIe Gen5/Gen6 (32–64 GT/s) MCIO / SlimSAS / OCuLink (dB @ 16 GHz) Calcula a perda total do canal Nyquist a 16,0 GHz (PCIe Gen5 32 GT/s NRZ e PCIe Gen6 64 GT/s PAM4), tolerância de impedância diferencial (85,0 Ω ± 5%) e orçamento de equalização de retimer. Protocol & Data Rate (32–64 GT/s) PCIe Gen5 (32.0 GT/s NRZ · 16 GHz Nyquist) PCIe Gen6 (64.0 GT/s PAM4 · 16 GHz Nyquist) Connector Family (85Ω Differential) MCIO 8i 74-Pin (SFF-TA-1016 · 0.75 dB/mated pair) SlimSAS 8i 74-Pin (SFF-8654 · 0.92 dB/mated pair) OCuLink 4i 42-Pin (SFF-8611 · 1.05 dB/mated pair) Twinax Cable Gauge & Plating 30 AWG Silver-Plated Solid Twinax (6.2 dB/m @ 16 GHz) 28 AWG Silver-Plated Twinax (5.1 dB/m @ 16 GHz) 32 AWG High-Density Flex Twinax (7.8 dB/m @ 16 GHz) Cable Harness Length (m) Host + Target PCB Stripline (inches) PCB Laminate Grade Megtron 7 + HVLP2 (0.68 dB/in @ 16 GHz) Megtron 8 + HVLP3 (0.54 dB/in @ 16 GHz) Megtron 6 + VLP (0.92 dB/in @ 16 GHz) Cable Assembly SDD21 @ 16 GHz-5.53 dB Harness Budget Margin (≤7.5 dB)+1.97 dB End-to-End Root-Complex to Endpoint-19.97 dB TDR Differential Impedance84.6 Ω (85Ω ±5%) Retimer / Equalization VerdictPASS (Direct Copper) BENCH-02 · IEEE 802.3ck / OIF-CMIS 5.2 400G/800G OSFP & QSFP-DD DAC / AEC TARGET: <1e-12 POST-EQ / PRE-FEC BENCH ### Bancada 2: Matriz de BER e Margem de Olho 400G/800G OSFP/QSFP-DD DAC & AEC (Avalia canais 100G/lane PAM4 (53,125 GBd) IEEE 802.3ck / OIF-CMIS 5.2 em cabos DAC passivos, ACC lineares e AEC com DSP retimer, verificando o limiar Select 400G/800G Interconnect SKU Profile OSFP-800G Passive DAC · 1.0m (26 AWG) QSFP-DD800 Passive DAC · 2.0m (26 AWG) OSFP-800G Active Electrical Cable (AEC) · 3.5m QSFP112-400G Active Electrical Cable (AEC) · 5.0m OSFP-800G-2xDR4 Optical Transceiver · 500m OSFP-800G Unretimed Passive DAC · 4.0m (Stress Reject) Cage Ambient Temperature (°C) Post-Equalizer Bench BER (<1e-12)1.2e-14 Raw KP4 Pre-FEC BER (≤2.4e-4)1.85e-6 PAM4 Eye Height / Width56.0 mV / 0.38 UI CMIS 5.2 Power & ECCN9.8 W · 5A991.b / EAR99 Form FactorMedia ArchitectureLengthIL @ 26.56 GHz Bench BER (<1e-12)KP4 Pre-FEC BEREye MarginExport ClassVerdict **OSFP-800G (8x100G PAM4)**Passive Twinax DAC (26 AWG)1.0 m14.8 dB`4.2e-14 (`1.1e-7`48.5 mV / 0.34 UIEAR99 (Passive Copper)PASS **QSFP-DD800 (8x100G PAM4)**Passive Twinax DAC (26 AWG)2.0 m19.4 dB`8.6e-13 (`8.4e-6`34.0 mV / 0.27 UIEAR99 (Passive Copper)PASS **OSFP-800G (8x100G PAM4)**Active Electrical Cable (AEC 7nm Retimed DSP)3.5 m26.2 dB`1.2e-14 (`1.85e-6`56.0 mV / 0.38 UI5A991.b / EAR99 (Non-MACsec L1 DSP)PASS **QSFP112-400G (4x100G PAM4)**Active Electrical Cable (AEC 7nm Retimed DSP)5.0 m28.1 dB`3.5e-13 (`4.1e-6`49.0 mV / 0.35 UI5A991.b / EAR99 (Non-MACsec L1 DSP)PASS **OSFP-800G-2xDR4 (1310nm EML)**Optical Transceiver (Dual MPO-12 APC 500m)500.0 m3.2 dB`9.0e-15 (`6.2e-7`62.0 mV / 0.41 UI5A991.b (Non-MACsec L1 PAM4 DSP)PASS **OSFP-800G (8x100G PAM4)**Over-Length Passive DAC (28 AWG Unretimed — Stress Reject)4.0 m33.8 dB`6.8e-9 (EXCEEDS 1e-12 BENCH)``4.9e-4 (FEC OVERFLOW)`9.5 mV / 0.08 UIEAR99FAIL — REQUIRES AEC RETIMER BENCH-03 · IEC 61300-3-35 Ed. 2.0 (400x Coaxial) IEC 61755-3-31 3D Interferometry (MPO-12 / MPO-16 APC 8°) PASS · 100% ZONE A CLEAN ### Bancada 3: Inspetor Pass/Fail de Face Final de Fibra 400x IEC 61300-3-35 e Interferometria 3D Avalia ferrolhos Singlemode OS2 APC 8° MPO-12/MPO-16 e LC Duplex segundo as regras de zonas A/B/C/D da IEC 61300-3-35 Ed. 2.0 e altura de protrusão 3D IEC 61755-3-31 (-50 nm a +500 nm). Inspection Lot Preset Lot 2026-Q3-DG-022 MPO-16 APC Elite (PASS) Uncleaned Field Ferrule · Zone A Defect (FAIL) MT Ferrule Fiber Undercut -95 nm (FAIL) Core Zone A (0–25 µm) Scratches / Defects Cladding Zone B (25–115 µm) Defects >5 µm 3D Fiber Protrusion Height (nm, -50 to +500) APC Polish Angle (° · Target 8.0° ±0.20°) 400x Zone A/B Visual VerdictPASS (0 Core Defects) 3D MT Ferrule Geometry+210 nm · 8.03° APC Estimated Insertion / Return LossIL 0.18 dB / RL 64.2 dB IEC 61300-3-35 Overall StatusPASS · READY FOR MATING BENCH-04 · IPC-2141A / IPC-TM-650 2.5.5.13 HVLP Copper Foil + Ultra-Low-Loss CCL PASS · EAR99 / 5A991 CLEARED ### Bancada 4: Verificador de Stackup CCL HVLP de Perda Ultrabaixa e Triagem EAR99 / 5A991 Verifica a impedância diferencial stripline (85,0 Ω PCIe vs 100,0 Ω Ethernet), Dk / Df @ 16 GHz em laminados Megtron 6/7/8 e Tachyon 100G com folha de cobre HVLP, e confirma conformidade comercial EAR99 / 5A991 sem MACsec. Copper-Clad Laminate (CCL) Material Panasonic Megtron 7 (Dk 3.35, Df 0.0020 @ 16 GHz) Panasonic Megtron 8 (Dk 3.20, Df 0.0014 @ 16 GHz) Isola Tachyon 100G (Dk 3.02, Df 0.0021 @ 16 GHz) TUC TU-883 SP (Dk 3.40, Df 0.0022 @ 16 GHz) Panasonic Megtron 6 (Dk 3.60, Df 0.0040 @ 16 GHz) Copper Foil Roughness Profile HVLP2 Copper Foil (Rz ≤ 1.5 µm · Standard AI Backplane) HVLP3 Copper Foil (Rz ≤ 1.0 µm · Gen6 / 1.6T Grade) VLP Copper Foil (Rz ≤ 2.5 µm) Standard RTF Foil (Rz ~ 3.8 µm · High Skin-Effect Loss) Target Differential Impedance 85.0 Ω ± 5% (PCIe Gen5/Gen6 Stripline) 100.0 Ω ± 5% (400G/800G Ethernet Stripline) Backdrilled Via Stub Length (mil · Max 6.0) Cryptographic Silicon on Board (Export Screen) None — Bare PCB / L1 Non-MACsec Retimer (EAR99 / 5A991) Populated L2 MACsec AES-GCM-256 PHY (Triggers 5A002 Review) Effective Dk / Df @ 16.0 GHzDk 3.35 / Df 0.0020 Stripline Attenuation @ 16 GHz0.68 dB / inch Impedance & Stub Resonance84.8 Ω · 4.2 mil Stub EAR99 / 5A991 Export ScreeningEAR99 / 5A991.b CLEARED PROVENIÊNCIA DE LOTE IMUTÁVEL · REGISTO SHA-256 ## Registos de Verificação do Lab 1 Referenciados por Cláusula (PRF-D2 / PRF-D1 / PRF-PCB) **test_method_clause**PCI-SIG PCIe 5.0 CEM §4.3 & SFF-TA-1016 Rev 1.4 / IPC-TM-650 2.5.5.7a (85Ω TDR & 4-Port VNA S4P to 32 GHz); OIF-CMIS-05.2 Clauses 8.2–8.9 & IEEE 802.3ck Clause 163 (400G/800G EEPROM & PAM4 BER); IEC 61300-3-35 Ed 2.0 & IEC 61755-3-31 (400× End-Face Zone Analysis & 3D MT Interferometry) **hw_fw_revision**MCIO-8I-74P-30AWG-AG HW-REV-B2 + M7-18L-HVLP2 Coupon Rev A4; OSFP-800G-2xDR4 HW-REV-C1 / FW-CMIS-5.2.14 (Non-MACsec EAR99/5A991); MPO16-APC8-OS2-ELITE HW-REV-A4 **sample_lot_scope & test_date**Combined Lots 2026-Q3-SZ-014 (n=25 MCIO 8i assemblies + 6 M7 Low-Dk stripline coupons), 2026-Q3-WH-008 (n=16 400G/800G optical/AEC modules), and 2026-Q3-DG-022 (n=40 MPO-16 APC trunks / 640 fiber cores) · `2026-10-02` **applicability_limitations**Applies strictly to tested 0.5m–0.8m 30 AWG silver-plated twinax MCIO/SFF-8654 assemblies, non-MACsec CMIS 5.2 optical/AEC modules on SONiC 202511 / Arista EOS 4.32.1F, and factory-sealed MPO-16 APC trunks. Host topologies exceeding 0.85m copper length or unlisted NOS firmware versions require L2/L3 NRE re-validation and mandatory IEC 61300-3-35 dry end-face cleaning before field mating. ARTIFACT: PRF-D2-PCIE5-85OHM TRACKS: D2 + PCB PROVENANCE: internal_bench PASS ### PCIe Gen5 MCIO 8i (SFF-TA-1016) & M7 Low-Dk PCB Coupon 85Ω Differential Impedance TDR & 4-Port S-Parameter (S4P) Verification test_method_clausePCI-SIG PCIe 5.0 CEM §4.3 / SFF-TA-1016 Rev 1.4 / EIA-364-108 / IPC-TM-650 2.5.5.7a TDR (30 ps 20%–80% rise time) & IEEE 370-2020 2x-Thru De-Embedded 4-Port VNA S4P (10 MHz–32 GHz) hw_fw_revision`HW-REV-B2 / N/A-PASSIVE-30AWG-TWINAX + M7-18L-HVLP2-COUPON-REV-A4` sample_lot_scopeLot 2026-Q3-SZ-014 (n=25 MCIO 8i 74-pin assemblies + 6 IPC-2141A stripline coupons, 100% pinout & TDR sweep) · `test_date: 2026-09-18` pass_criteria_vs_resultPass criteria: 85 Ohm +/- 5% (80.75-89.25 Ohm), Insertion Loss <= -7.5 dB @ 16 GHz, Return Loss SDD11 <= -12.0 dB; Result: 84.6 Ohm mean, -6.1 dB @ 16 GHz, SDD11 -15.4 dB (PASS) report_sha256 & disclaimer `e3b0c44298fc1c149afbf4c8996fb92427ae41e4649b934ca495991b7852b855` SHA-256 digest of the raw Touchstone (.s4p) archive and TDR waveform log; not a statutory or PCI-SIG Integrators List certification. applicability_limitationsApplies strictly to Lot 2026-Q3-SZ-014 0.5m-0.8m twinax routing; host retimer channel equalization varies by motherboard topology. ARTIFACT: PRF-D1-CMIS-800G TRACKS: D1 + D13 PROVENANCE: internal_bench PASS ### 400G/800G OSFP/QSFP-DD OIF-CMIS 5.2 EEPROM Memory Map, VDM Telemetry & Thermal State-Machine Verification (Non-MACsec EAR99/5A991) test_method_clauseOIF-CMIS-05.2 Clauses 8.2-8.9 (Module & DataPath State Machines, Pages 00h/01h/10h/11h/13h/14h) & IEEE 802.3ck Clause 163 (100G/lane PAM4 KP4 FEC) hw_fw_revision`HW-REV-C1 / FW-CMIS-5.2.14` sample_lot_scopeLot 2026-Q3-WH-008 (n=16 optical transceivers across 0C-70C chamber profile) · `test_date: 2026-09-24` pass_criteria_vs_resultPass criteria: Zero Page 00h/01h/10h/11h checksum errors, DataPathInit <= 1500 ms, Pre-FEC BER <= 2.4e-4; Result: 0 errors, 840 ms max init, Pre-FEC BER 1.85e-6 mean (PASS) report_sha256 & disclaimer `4a7d1ed414474e4033ac29ccb8653d9b4a7d1ed414474e4033ac29ccb8653d9b` SHA-256 digest of the CMIS 5.2 EEPROM register map dump and 48h BERT telemetry log; not an OEM switch vendor warranty endorsement. applicability_limitationsVerified on SONiC 202511 and Arista EOS 4.32.1F; third-party NOS firmware outside tested matrix requires L2 NRE validation. ARTIFACT: PRF-D1-FIBER-400X TRACKS: D13 + D1 PROVENANCE: iso17025_external PASS ### MPO-12/MPO-16 APC 400× Coaxial End-Face Inspection vs. 3D White-Light Interferometry Ferrule Geometry Proof test_method_clauseIEC 61300-3-35 Ed. 2.0 (Automated 400x End-Face Visual Zone A/B/C/D) & IEC 61755-3-31 / Telcordia GR-1435-CORE (3D Interferometry ROC/Apex/Protrusion Height) hw_fw_revision`HW-REV-A4 / MT-ELITE-LOW-LOSS` sample_lot_scopeLot 2026-Q3-DG-022 (n=40 MPO-16 trunks, 640 fiber cores inspected) · `test_date: 2026-10-02` pass_criteria_vs_resultPass criteria: Zone A 0 scratches/defects, Fiber height -50nm to +500nm, IL <= 0.35 dB, RL >= 60 dB; Result: 100% Zone A clean, max IL 0.24 dB, min RL 64.2 dB (PASS) report_sha256 & disclaimer `9f86d081884c7d659a2feaa0c55ad015a3bf4f1b2b0b822cd15d6c15b0f00a08` SHA-256 digest of the serialized 640-core 3D interferometry and 400x end-face inspection archive; not a blanket factory certification. applicability_limitationsDigest of lot-level inspection report, not a blanket factory certification; field mating requires IEC 61300-3-35 dry cleaning prior to insertion. ARTIFACT: PRF-PCB-HVLP-EAR99 TRACKS: PCB + D2, D13 PROVENANCE: iso17025_external PASS ### 18-Layer Megtron 7 HVLP2 Ultra-Low-Loss CCL Stripline Stackup & EAR99 / 5A991 Export Screening Audit test_method_clauseIPC-TM-650 2.5.5.13 Split-Cylinder Resonator (Dk/Df @ 16 GHz), IPC-2141A Controlled Differential Stripline (85.0 Ω ± 5% PCIe / 100.0 Ω ± 5% 800G Ethernet), IPC-TM-650 2.6.27 Thermal Stress (6x 288°C Solder Float), & US BIS 15 CFR Part 774 Cat 3A/5A (EAR99 / 5A991.b Non-MACsec Screening) hw_fw_revision`M7-18L-HVLP2-COUPON-REV-A4 (Panasonic R-5785N + 1/2 oz HVLP2 Rz 1.3 µm + Backdrilled Stub ≤ 6 mil)` sample_lot_scopeLot 2026-Q3-SZ-014-PCB (n=6 IPC-2141A 18-layer stripline coupons + cross-section microsectioning + BOM export control audit) · `test_date: 2026-09-20` pass_criteria_vs_resultPass criteria: Dk 3.35 ± 0.05 & Df ≤ 0.0022 @ 16 GHz, Stripline Zdiff 85.0 Ω ± 5% (PCIe) & 100.0 Ω ± 5% (800G), via stub ≤ 6.0 mil, zero delamination after 6x 288°C, zero 5A002 cryptographic MACsec silicon; Result: Dk 3.34 / Df 0.0019 @ 16 GHz, Zdiff 84.8 Ω & 99.6 Ω, stub 4.2 mil max, EAR99 bare PCB / 5A991.b L1 interconnect confirmed (PASS) report_sha256 & disclaimer `8f434346648f6b96df89dda901c5176b10a6d83961dd3c1ac88b59b2dc327aa4` SHA-256 digest of the IPC-TM-650 2.5.5.13 split-cylinder Dk/Df report, microsection coupon log, and ECCN self-classification matrix; not a formal BIS CCATS ruling. applicability_limitationsApplies strictly to passive bare PCBs (EAR99) and Layer-1 non-MACsec retimed riser/AEC assemblies (5A991.b / EAR99); addition of Layer-2 AES-GCM-256 MACsec PHY silicon requires separate Cat 5 Part 2 5A002 / ENC review.